PCB Capabilities
| Item | Production capability |
|---|---|
| Number of layers | Prototypes: max 12 layers / Mass production: 1 – 8 |
| Type of material |
FR-4, CEM-1, HTG(170), Rogers(RO4003C), Aluminum
|
| Material thickness | Min 0.4mm---Max 4.0mm |
| Copper thickness | 17um, 35um, 70um, 105um |
| PCB thickness | 0,4----2,4 mm |
| Solder Mask color | green, white, blue, red, yellow, black, other – by recommendation |
| Max board size | 1 layer and 2 layers: 510 x 750 mm / multilayer: 500 x 600 mm |
| Min track width | 4mil/0.1mm |
| Min track spacing | |
| Min hole size | 8mil /0.2mm |
| BGA | Yes |
| Surface finishing | HAL, HAL lead free, ENIG |
| Contour finishing | CNC Routing |
| Quality standard | IPC-A-600G CLASS Ⅱ |
